OmniScan MX Eddy Current Array Flaw Detector

OmniScan MX Eddy Current Array Flaw Detector

The OmniScan MX Eddy Current Array Flaw Detector is a field-proven, compact, and versatile inspection solution designed for manual and semi-automated eddy current and eddy current array (ECA) applications. With support for conventional ECT, ECA, and bond testing technologies, the OmniScan MX offers high-resolution imaging, real-time data acquisition, and robust performance in harsh inspection environments. Featuring a bright 8.4-inch color display and dual Li-ion batteries, this system provides exceptional usability and up to 6 hours of inspection time. It supports a wide range of applications, including detection of surface-breaking cracks, corrosion, and delaminations—even through thin coatings like paint.

Key Features of OmniScan MX Eddy Current Array Flaw Detector

• Multi-Technology Support: Compatible with ECT, ECA, and bond testing (BT C-scan) modules for flexible inspection.

• Large Coverage with High POD: ECA probes offer fast, high-resolution scanning over large areas in a single pass.

• Through-Coating Inspection: Capable of detecting defects under thin layers of paint or coatings without removal.

• Real-Time Color Display: 8.4 in. TFT LCD screen with 16 million colors and multiple view modes (C-scan, impedance plane, etc.).

• Data Archiving and Reporting: Built-in analysis, reporting, and instant data storage to CompactFlash or USB.

• Continuous Encoder Mode: Enables encoder-corrected imaging with time-based scan flexibility.

• Powerful Software (MXE 3.0): User-friendly interface with patented color palettes replicating traditional NDT methods.

• Dual Probe Support: Seamlessly switch between ECT and ECA probes during inspection for maximum versatility.

Applications of OmniScan MX Eddy Current Array Flaw Detector

• Stress Corrosion Cracking Detection: Identify and evaluate surface-breaking cracks in stainless steel and alloys.

• Aircraft Skin & Fastener Row Inspection: Rapid detection of fatigue cracks around fasteners—even through coatings.

• Paint-Free NDT: Eliminate the need for paint removal during flaw detection with ECA technology.

• Pressure Vessel and Pipe Inspection: Detect surface defects, corrosion, and cracks in pressure vessels and piping systems.

• Bond Testing & Delamination: Detect disbonds and laminate separation in composite materials using bond testing C-scan mode.

• Subsurface Flaw Detection: Identify laminar cracking in nonmetallics and fiberglass components.

Included Accessories

• OmniScan MX instrument with ECA/ECT module

• Two smart Li-ion batteries

• DC charger with regional power cord

• CompactFlash card and USB communication cable

• Transport case (rugged, splashproof design)

• Probe cables (ECT and ECA)

• Hand strap

• BondMaster PC software (for data analysis and reporting)

• Getting started manual and product documentation