Multimode Bond Tester from Olympus BondMaster 600 – Composite Bond Tester
The BondMaster 600 Flaw Detector is an advanced, portable bond tester designed to evaluate the integrity of composite structures using multiple non-destructive testing (NDT) methods. Featuring high-quality signal processing, multiple inspection modes, and an intuitive interface, it delivers fast, reliable results across a wide range of materials, including honeycomb structures, metal-to-metal bonds, and laminate composites. Available in basic (B600) and multimode (B600M) models, the system meets the needs of aerospace, automotive, and manufacturing professionals seeking accurate, field-ready NDT solutions.
Key Features of the BondMaster 600 Flaw Detector | Tester
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Multimode Inspection: Supports Pitch-Catch (RF, Impulse, Swept), Resonance (B600M), and MIA (B600M) testing.
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Intuitive Interface: Streamlined menu system with application presets and a full settings modification screen.
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High-Resolution Display: 5.7-inch VGA color LCD with real-time display and full-screen mode for reduced eye strain.
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Real-Time Feedback: Up to two real-time readings with options like amplitude, phase, or frequency data.
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Rugged and Portable: IP66-rated design, lightweight (1.7 kg), and up to 9 hours of battery life.
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Data Management: Save up to 500 files, preview on device, and export reports via USB using included PC software.
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Frequency Tracking & Spectrum View: Analyze and visualize signal frequency behavior for procedure development.
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Application Presets: Factory-configured for quick setup in common inspections, including composite delamination and disbond detection.
Industrial Applications of the Bond Master 600 for Bond Testing
Aerospace Composite Bond Testing and Delamination Detection.
Marine Structure Integrity Testing Using Ultrasonic Methods.
Automotive and Racing Composite Inspection with Portable NDT Tools.
Wind Blade and Laminate Structure Testing Solutions.
Quality Control in Manufacturing with Handheld Bond Testers.
Inspection Modes and Applications
| Application | Recommended Method |
|---|---|
| Honeycomb skin-to-core disbonds | Pitch-Catch (RF or Impulse) |
| Non-constant geometry composites | Pitch-Catch (Swept) |
| Small disbonds, far-side defects | MIA (Mechanical Impedance Analysis) |
| Repaired area identification | MIA |
| Metal-to-metal bonding | Resonance |
| Delamination in laminates | Resonance |
Mode-Specific Features
Pitch-Catch (All Models)
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Modes: RF, Impulse, Swept
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Frequency: 1 kHz – 100 kHz (Swept)
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Auto Gate Function
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Spectrum View with Frequency Tracking
MIA – Mechanical Impedance Analysis (B600M only)
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Frequency: 2 kHz – 50 kHz
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Real-time amplitude/phase readings
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SCAN view for disbond tracking
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Ideal for honeycomb composite repairs
Resonance (B600M only)
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Frequency: 1 kHz – 500 kHz
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X-Y display with phase rotation interpretation
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Factory presets for laminate and metal bonds
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Reference dot tracking system
Data, Reporting & Connectivity
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Export Options: PDF, on-screen preview, USB download
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BondMaster PC Software: Included for report generation and file management
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Languages: 15 interface languages, including English, Spanish, French, Japanese, Russian, Chinese
Included Accessories
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BondMaster 600 (Basic or Multimode)
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Li-ion Battery + AA Battery Tray
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Rigid Transport Case
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DC Charger & Regional Power Cord
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USB Cable, microSD Card & Adapter
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Hand Strap, Instruction Labels
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BondMaster PC Software & Manuals
Model Comparison
| Feature | B600 (Basic) | B600M (Multimode) |
|---|---|---|
| Pitch-Catch RF & Impulse | ✅ | ✅ |
| Pitch-Catch Swept | ✅ | ✅ |
| Mechanical Impedance Analysis (MIA) | ❌ | ✅ |
| Resonance Mode | ❌ | ✅ |
| Frequency Tracking | ✅ | ✅ |
| Application Presets | ✅ | ✅ |
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